Aravindsundeep Musunuri

Aravind Sundeep is a seasoned Electronics Engineer with over 11 years of expertise in high-speed digital design and hardware development. Currently a Hardware Engineer at Arista Networks, he is adept at system architecture, hardware design, and signal and power integrity analysis. His experience spans roles at Cavium Networks as a Lead Hardware Engineer, and previous positions at SAI Technology, Vignani Technologies, and CoreEL Technologies. Aravind has a strong background in developing hardware systems with multicore network and server processors, and his educational qualifications include a BS in Micro Electronics from Manipal Academy of Higher Education and an Advanced Diploma in Electronics Engineering. Aravindsundeep Musunuri is a highly adaptive Electronics Engineer with over 14 years of industrial experience in high-speed digital design, specializing in hardware systems for networking, server platforms, and semiconductor technologies. His expertise spans system architecture, hardware design, component selection, power design, signal integrity analysis, PCB design, and subsystem specification. He has played a pivotal role in developing high-speed motherboards with Intel X86, MIPS, and ARM processors, as well as designing multi-gigabit serial links for advanced interconnects such as PCIe, Interlaken, and PAM4 signaling at 56G and 112G data rates. Proficient in FPGA and CPLD glue logic design, he has demonstrated exceptional skills in board bring-up, design verification, system reliability validation, and compliance testing. Aravindsundeep has extensive experience in package-level and system-level signal and power integrity analysis, leveraging advanced simulation tools such as HyperLynx, Ansys SIwave, ADS, and IBIS-AMI to optimize high-speed interfaces. His professional journey includes significant roles at Arista Networks, Infinera Corporation, Marvell Semiconductors, Qualcomm Inc., and other leading firms, contributing to the development and validation of high-bandwidth networking switches, fiber optic systems, multi-core processors, and 802.11n Wi-Fi adapter cards. At Arista Networks, he has been instrumental in designing and validating high-speed SerDes data paths, ensuring optimal performance for data center switches operating at speeds up to 800G. His role at Marvell Semiconductors involved supporting customers and field applications teams in positioning multi-core network and server processors while conducting advanced signal integrity analysis and lab measurements. At Qualcomm Inc., he was responsible for RF characterization of 4x4 MIMO 802.11n Wi-Fi systems, evaluating key parameters such as phase noise, jitter, and error vector magnitude (EVM). His contributions extend beyond hardware design to software development, including modifying bootloaders (u-boot, UEFI), developing board support packages (BSP), and creating automation programs using Python, Perl, Bash, and C for silicon validation and hardware systems testing. His deep technical acumen is complemented by his ability to work closely with contract manufacturers, optimizing cost and performance while ensuring high-yield manufacturing. He has also been actively involved in drafting detailed design verification test plans, creating system design guidelines, and providing technical applications support to field engineers, customers, and partners. His strong background in regulatory testing and compliance ensures that designs meet stringent FCC and UL standards. Recognized for his innovative contributions, Aravindsundeep has been awarded two US patents, with two more in progress, highlighting his impact in advancing hardware engineering solutions. His career is further distinguished by multiple awards, including Best Employee recognition and selection for advanced training programs in the United States. He holds a Bachelor's degree in Microelectronics from Manipal University and an Advanced Diploma in Electronics and Communication Engineering from NTTF Bangalore. His diverse international experience is supported by business visas for the United States, China, and South Korea, underscoring his global engagement in hardware engineering and technology development.