Chemical Vapor Deposition (CVD)

Chemical Vapor Deposition was an international peer-reviewed scientific journal dedicated to research on chemical vapor deposition (CVD) processes and related thin-film technologies. It focused on the synthesis, characterization, and application of materials formed through vapor-phase chemical reactions, including metal oxides, semiconductors, ceramics, and nanostructured coatings. The journal served as a multidisciplinary platform for chemists, physicists, and materials engineers working in advanced materials processing. Established in 1995 and published by Wiley-VCH (Germany), the journal released monthly issues until 2015. In 2016, it was integrated into Advanced Materials Interfaces, continuing its thematic scope within a broader materials science journal. The journal published original research articles, reviews, and short communications covering experimental and theoretical aspects of CVD techniques, reactor design, precursor chemistry, thin film growth mechanisms, and industrial applications such as microelectronics, optoelectronics, and protective coatings. The journal was widely indexed in major databases like Scopus and Science Citation Index, making it a recognized source in materials science research. Its contributions significantly supported advancements in nanotechnology, semiconductor fabrication, and surface engineering, particularly during the rapid development of thin-film deposition technologies in the late 20th and early 21st centuries.

Chemical Vapor Deposition (CVD) is :-

• International, Peer-Reviewed, Open Access, Refereed, Materials Science, Chemical Engineering, Surface & Interface Science, Thin Films & Coating Technology, Semiconductor Materials, Applied Physics, metal oxides, semiconductors, ceramics, nanostructured coatings , Online or Print , Monthly Journal

• UGC Approved, ISSN Approved: P-ISSN P-ISSN: 0948-1907, E-ISSN: 1521-3862, Established: 1995,
• Does Not Provide Crossref DOI

• Not indexed in Scopus, WoS, DOAJ, PubMed, UGC CARE