Go Back Research Article March, 2025

Advancements and Challenges in the Design, Fabrication, and Scalability of Modern VLSI Technology for High-Performance Integrated Circuits

Abstract

The rapid progression in Very-Large-Scale Integration (VLSI) technology has paved the way for increasingly complex, high-performance, and power-efficient integrated circuits (ICs). With the transition into sub-5nm nodes and the integration of novel transistor architectures such as Gate-All-Around FETs (GAA-FETs), the design and fabrication of VLSI circuits are experiencing a transformation. This paper explores the advancements, ongoing challenges, and the scalability implications of these technological shifts. Emphasis is placed on transistor scaling, interconnect complexity, power and thermal constraints, and manufacturability at atomic scales.

Keywords

vlsi high-performance ics gaa-fet interconnect fabrication power efficiency scaling cmos finfet 3d ics
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Volume 5
Issue 1
Pages 1-5
ISSN 0088-4917