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Abstract
The increasing complexity of heterogeneous electronic packaging systems has led to significant challenges in managing thermal and electromagnetic interference (EMI) effects. This paper presents a multiphysics simulation approach to analyze and mitigate these issues in advanced electronic packaging. By integrating thermal and electromagnetic simulations, the proposed methodology provides a comprehensive understanding of the interactions between heat dissipation and EMI in heterogeneous systems. The study demonstrates the effectiveness of the approach through case studies, highlighting its potential for optimizing packaging designs to enhance performance and reliability. The results indicate that the proposed framework can significantly reduce thermal hotspots and EMI, ensuring robust operation in high-density electronic systems.
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