MR

MANJUNATH REDDY

Principal Engineer at Qualcomm
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👤 About

Skills & Expertise

Android ARM Assembly Coding Audio Video Codecs Optimization Automation Tools Analytics Benchmarking Build Integration Customer Support Salesforce Debugging Edge AI Gen AI GIT Global Demonstrations JIRA Jenkins LINUX MATLAB Testing Multimedia Demo Bug Tracking Project Management Performance Pre/Post Sales Support REPO Scripting Software Development Strategy Roadmap Planning Execution Testing Triaging Ultrasonic Sensor Validation

Research Interests

Leadership Team Management Technical Expertise Customer Engagement Project Management Communication Salesforce

Connect With Me

💼 Experience

Principal Engineer

Qualcomm · July 2016 - Present
Leading the commercialization of Qualcomm 3D Sonic Sensor fingerprint solution for Snapdragon chipsets. Managing a team of 20 software engineers across multiple locations. Contribute to major software features, including the development of Under-Display Ultrasonic Fingerprint solutions for various devices. Developed the first Under-Display Ultrasonic Fingerprint solutions on Samsung, Google, Vivo, and Xiaomi devices. Play a key role in successful product launches for Samsung Galaxy Series and ensure seamless integration. Contributing to the platform Monetization initiatives with Fingerprint cards in April 2017. Collaborate with cross-functional teams and third-party vendors to gather customer requirements and perform validations on Snapdragon Semiconductor platforms. Successfully meet product specifications and program schedules while overseeing design and development. Demonstrate proficiency in Salesforce and professional communication while addressing customer inquiries and concerns.

Sr. Project Manager (Contracted by L & T InfoTech & Mindlance)

Qualcomm · November 2009 - July 2016
Provided extensive support for Qualcomm's Android development platforms, including SnapdragonTM 7xxx and 8xxx Mobile, tablet, and Dragon board Development Platform series. Coordinated team activities, managed deliverables, and supported customer engineering and product management teams, contributing to successful product launches. Blogger Event planning, support and execution in numerous shows including showcasing CPU/GPU/Browser benchmarking. Breakdown and setup for trade shows such as CES, MWS, Uplink, Computex etc. Feature technology demos support for CES, MWS, Uplink, Computex etc. Hackathon event preparation and execution support. Demonstrations of Snapdragon 810 features in Qualcomm's tradeshow venue during the 2015 Consumer Electronics Show CES in Las Vegas, NV. First MSM8660 MDP's to top industry technical bloggers and helping demonstrate the strength of new dual core snapdragon platform prior to commercial device launch. Managed, tracked, and controlled bugs and change requests, ensuring the delivery of quality fixes within timelines. Product and application development platform support, stable Android builds, custom camera sensor support, multimedia demo team support, documentation, and customer issue resolution. Additional duties involved wide-ranging responsibilities such as tracking Android, Linux, and kernel issues, supporting modem release plans, and addressing customer inquiries through professional communication.

Engineer (Contracted by L & T InfoTech & Mindlance)

Core Logic Mobile · June 2005 - July 2009
Integrated AAC decoder with OpenMAX IL into streamer framework. Ported and optimized AC Audio-decoder for ARM9. Ported and tested Mpeg4 Decoder on ARM9 customized Board. Developed Movie Converter Using Direct X. Ported and optimized MP3 Encoder on ARM946ES. Merged BSAC EAAC Codec's on ARM9E Processor. Ported and optimized BSAC Audio-decoder on ARM9. Converted HLOS Codec WMA9 decoder) for custom ARM board.

Systems Analyst (Contracted by Satyam Computers Service Ltd)

Microsoft Corporation · June 2004 - June 2005
Developed support for Video Conferencing system.

Systems Analyst (Contracted by Satyam Computers Service Ltd)

Chroma ATE Inc. · January 2004 - June 2004
Designed RS232 driver and Battery algorithms for UPS system using TMS320c240 DSP.

🏆 Awards & Achievements (5)

🏆 Excellence Award
Awarded by: || Year:
🏆 Excellence Award
Awarded by: || Year:
🏆 Excellence Award
Awarded by: || Year: 2015
🏆 Larsen & Toubro Awards
Awarded by: Larsen & Toubro || Year:
🏆 Qualcomm, Qualstar Award
Awarded by: Qualcomm || Year:

💡 Patents (1)

Ultrasonic Fingerprint technology on mobile / wearable devices
Patent No. · Filed · Issued on
Inventors: || Category: Agricultural Sciences
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