Soldering & Surface Mount Technology (SSMT)

Publisher : Emerald Publishing Limited

Soldering Technology Surface Mount Technology Electronics Assembly

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e-ISSN 1758-6836

p-ISSN 0954-0911

Issue Frequency Bi-Monthly

Impact Factor 1.8

Est. Year 1989

Mobile 4401133231381

DOI YES

Country United Kingdom

Language English

APC YES

Impact Factor Assignee Google Scholar

Email nanojoin@hit.edu.cn

Journal Descriptions

Soldering & Surface Mount Technology (SSMT) seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches. Among the range of topics covered are: Soldering science and technology Novel soldering processes and new solder alloys Surface mount technology (SMT) Surface mount assembly Advanced packaging technologies and 3D interconnects Flip chip/BGA/SiP/TSV Novel substrates and embedded components Solderable finishes and coatings Screen printing Conductive adhesives and conformal coatings Reliability Quality control Inspection and testing Rework and repair Environmental aspects Soldering & Surface Mount Technology (SSMT) is a unique, authoritative, international and multi-disciplinary periodical for those with a research and application interest in all branches of soldering and surface mount technologies

Soldering & Surface Mount Technology (SSMT) is :-

International, Peer-Reviewed, Open Access, Refereed, Soldering Technology, Surface Mount Technology, Electronics Assembly, Materials Science, Packaging Technology, Reliability Engineering, Quality Control, Environmental Engineering , Online or Print , Bi-Monthly Journal
UGC Approved, ISSN Approved: P-ISSN P-ISSN: 0954-0911, E-ISSN: 1758-6836, Established: 1989, Impact Factor: 1.8
Provides Crossref DOI
Indexed in: Scopus, WoS
Not indexed in DOAJ, PubMed, UGC CARE