Journal of Electronic Packaging (JEP)

The Journal of Electronic Packaging is a quarterly, peer‑reviewed scholarly journal published by the American Society of Mechanical Engineers (ASME) that serves as an international forum for high‑quality research on electronic and photonic packaging engineering. Established in 1989, it addresses fundamental and applied problems encountered in the design, manufacturing, and operation of electronic systems, especially where mechanical and materials issues intersect with thermal management and microsystems integration. The journal publishes original research articles, analytical and computational studies, and experimental investigations that contribute to the understanding and innovation of packaging technologies. Topics span thermal transport and heat dissipation in electronic assemblies, reliability and stress analysis, materials characterization, interconnect technologies, packaging processes, and integration of microsystems and photonics components. Emphasis is placed on solutions that demonstrate originality, engineering rigor, practical relevance, and applicability to real‑world systems. Serving researchers and engineers in both academic and industrial settings, the journal promotes advances that underpin more reliable, efficient, and compact electronic and photonic systems. In addition to regular technical papers, invited review articles highlight emerging directions and critical developments in the field. As part of ASME’s Transactions of the ASME publications, this journal contributes to the engineering community’s understanding of emerging challenges in electronic packaging technology.

Journal of Electronic Packaging (JEP) is :-

• International, Peer-Reviewed, Open Access, Refereed, Electrical and Electronic Engineering, engineering challenges in the analysis, design, manufacturing, testing, operation, and reliability of electronic, optoelectronic, and photonic components, devices, systems, It emphasizes experimental, analytical, and computational methods used to tackle mechanical, materials, thermal management, thermal management in electronics, applied mechanics, microsystems packaging, systems integration, interconnects and substrates, materials with micro/nanoscale structures , Online or Print , Quarterly Journal

• UGC Approved, ISSN Approved: P-ISSN P-ISSN: 1528-9044, E-ISSN: 1043-7398, Established: 1989, Impact Factor: 2.3
• Does Not Provide Crossref DOI

• Not indexed in Scopus, WoS, DOAJ, PubMed, UGC CARE