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Journal Photo for IEEE Transactions on Signal and Power Integrity
Peer reviewed only Open Access

IEEE Transactions on Signal and Power Integrity (ITSPI)

Publisher : IEEE
integrated circuits IC packages printed circuit boards
e-ISSN 2768-1866
Issue Frequency Yearly
Est. Year 2022
Mobile 12124197900
DOI YES
Language English
APC YES
Impact Factor Assignee GOOGLE SCHOLAR
Email jun.fan@ieee.org

Journal Descriptions

The IEEE Transactions on Signal and Power Integrity publishes research and application papers addressing all aspects of signal integrity and power integrity of an electronic system and its components including integrated circuits, IC packages, printed circuit boards, cables, connectors, as well as other relevant electronic and microelectronic components, and signal integrity/power integrity co-design. Advances in theory, algorithms, design approaches and modeling for ensuring the fidelity and performance of digital, analog, and hybrid electronic systems and sub-systems are considered.

IEEE Transactions on Signal and Power Integrity (ITSPI) is :-

  • International, Peer-Reviewed, Open Access, Refereed, integrated circuits, IC packages, printed circuit boards, cables, connectors, performance of digital, analog , Online , Yearly Journal

  • UGC Approved, ISSN Approved: P-ISSN E-ISSN: 2768-1866, Established: 2022,
  • Provides Crossref DOI
  • Not indexed in Scopus, WoS, DOAJ, PubMed, UGC CARE

Indexing