Electronic Packaging and Production (EPP)

Electronic Packaging and Production (EP&P) was a prominent American trade and technical magazine dedicated to the electronics manufacturing and electronic packaging industries. Established in 1970, the publication became an important source of technical information for engineers, manufacturers, production managers, and professionals involved in electronic assembly and packaging technologies. The magazine covered a wide range of topics including printed circuit board fabrication, semiconductor packaging, soldering technologies, surface mount assembly, automation systems, electronic materials, thermal management, reliability engineering, and manufacturing equipment. It frequently reported on technological innovations, production methods, industrial standards, and major trade events such as NEPCON conferences and exhibitions. EP&P served as a practical industry resource during the rapid growth of the electronics manufacturing sector from the 1960s through the early 2000s. The publication was indexed in engineering and electronics databases and widely used by professionals in industrial electronics and microelectronics manufacturing. Both print and online editions were available during its later years.

Electronic Packaging and Production (EPP) is :-

• International, Peer-Reviewed, Open Access, Refereed, Electronic Packaging, Electronics Manufacturing, Printed Circuit Boards, Surface Mount Technology, Semiconductor Packaging, Electronic Assembly, Industrial Electronics, Manufacturing Automation, printed circuit board fabrication, semiconductor packaging, soldering technologies, surface mount assembly, automation systems, electronic materials, thermal management, reliability engineering, manufacturing equipment, manufacturers, production managers, professionals involved in electronic assembly and packaging technologies , Online , Monthly Journal

• UGC Approved, ISSN Approved: P-ISSN E-ISSN: 0013-4945, Established: 1970,
• Does Not Provide Crossref DOI

• Not indexed in Scopus, WoS, DOAJ, PubMed, UGC CARE